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Common Problems in the PCB Assembly Process

Úvod Fóra E-Poradna Common Problems in the PCB Assembly Process

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    <br>A lot of people have seen printed circuit board (Peb) signs or have even handled one. The reason for this may be that they are a part of our daily lives. Pressed into a mouse, held in your hand, or carried around in a backpack – these small, plastic-sided devices are everywhere. You use them almost daily, yet you hardly ever think about what is behind them. That’s because the PCB assembly process is so simple.<br>
    <br>Printed circuit boards (PCB) are utilized to interconnect electronic components and to supply power to these components via the electrical interfaces they form. If you liked this article and you would like to be given more info pertaining to how about Fast Turn printed circuit board manufacturers generously visit our website. Most individuals recognize pcb assembly processes by their appearance: They are usually comprised of a black PCB, a front panel of copper (or other colored surface), and a back panel of clear plastic. Behind these outer surfaces are several individual PCB components, each of which carries an LED, resistive, inductive, or a combination of other components on its surface. These components are pressed together along a PCB frame, using techniques such as hot air glue and mechanical roll laminating.<br>
    <br>One of the more important aspects of the pcb assembly process is solder masking. This is the process of masking any surface area that can be removed during the soldering process to allow the solder to flow freely. It is often done during the soldering process itself, when the component is hot glue grafted together. However, it can also be performed later, once the components have cooled and the glue has dried.<br>
    <br>Aside from the solder masking process, another important aspect of the pcb assembly process is the assembly testing. The testing of the pcb assembly ensures that all the joints are solid and secure. It also checks the stability of the components, to ensure that they will not fall off in the middle of production. Tested parts are given a passing score and are marked accordingly with an „E“ through „K“ for assembly testing.<br>
    <br>The final step in the pcb assembly process involves testing the finished product, called the SMT testing. This step specifically checks for errors in the positioning and alignment of the parts, as well as checking for melted or trimmed spots. The SMT testing is done using electronic personnel, who will stand in front of the component and manually examine it for imperfections in the soldering paste, in the shape of „hot spots“.<br>
    <br>All the components of a PCB must be carefully controlled and aligned in order to prevent contamination. In addition to using a manual SMT test to detect hot spots, automated software called a PCB Tracking Software package is available to inspect the full assembly. Once the entire SMT is examined, the software provides detailed information about each individual component. Components are then labeled according to their position in the board, which helps greatly in identifying them when working with them in production.<br>
    <br>Some electronic components require very specific equipment to make them work. In the case of circuit board assembly, electronic components such as plating spots, resistors, LEDs, and even certain IC’s are used. For these components, it is essential to have special equipment, such as an electro-plating station, in order to properly align and position the component. Otherwise, the solder joints might melt, causing the entire assembly to fail. An alternative method of preventing solder joint failure is to use a DC meter in conjunction with a resistance meter, to monitor the resistance in order to check for overheating.<br>
    <br>A final common problem in the manufacturing of PCB’s involves the side mixed assembly, where several layers of PCB material stack up on top of each other, creating a thick layer of glue that cannot be easily removed. Because of this, excess glue is often visible from both the bottom and the top. To combat this problem, the majority of PCB’s have two sides: one side designed to accept different types of adhesive, and the other side designed to hold the glue. This makes it easy to remove excess glue from the bottom surface of the PCB. Another method used to combat the presence of excess glue is to place small dots of glue on the top of the PCB.<br>

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